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Plasma Etch & Deposition
PlasmaStar 100
PlasmaStar 200
Details description

PlasmaStar 100/200

A Unique Modular Approach to Barrel Plasma Processing

The PlasmaSTAR® Series of Plasma Processing Systems from Axic, Inc. defines a new concept in barrel plasma processing. The systems are based on a modular design concept. Starting with a universal base unit, multiple electrode modules are available for easy insertion into the base unit. You will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma.

- Interchangeable Electrode Modules

- A Multiple Electrode Configurations: Cage, Tray, RIE, Downstream

- Proven Process Recipes

- Field Proven Components

- End-Point Detection (optional)

- Auto RF Matching

- Downstream Pressure Control (optional)

- Computer Controlled

- Touch Screen Operation

- Multiple Pumping Options

System Description

In the research, process development and production of plasma processing, the need for a highly versatile and reliable tool is always in considerable demand. With the ever changing requirements in plasma research, the system selected must he capable of offering the widest range of process parameters, highest degree of repeatability for verifying the process and easily modified for new process requirements. The PlasmaSTAR® series of dry process systems will satisfy the demanding requirements necessary to perform these tasks. The PlasmaSTAR® is a plasma tool used in research, process development and volume production for photo-resist striping and descuming, isotropic and an isotropic etching, organic ashing, hybrid circuit cleaning, printed circuit board desmearing, failure analysis, surface treatment and modification of plastics, polymer deposition, and a wide range of other plasma applications.

The PlasmaSTAR® product line offers a uniquely new modular approach to barrel plasma systems. The PlasmaSTAR® will accommodate the processing of 200 mm or smaller substrates. (For single wafer RIE processing of 300 mm wafers) The selection of proven, quality components, modular sub assemblies, versatile chamber-electrode design, compact size, automation and field proven process recipes will make the PlasmaSTAR® the "system of choice" for plasma process engineers.


With the PlasmaSTAR®s wide selection of chamber and electrode configurations the system is capable of satisfying a wide range of plasma processing conditions. These processes range from simple surface cleaning to sophisticated submicron RIE etching. Axic, Inc., in conjunction with our large customer b ase has developed proven process recipes guaranteeing your system is up and processing from the day you install the system. Only the highest quality sub components are used in the manufacturing of the PlasmaSTAR® system providing the highest up-time, reliability, repeatability and serviceability.

Typical processes include:

- Plasma Descuming

- Photo-Resist Stripping

- Surface Treatment

- Anisotropic & Isotropic Etching

- Failure Analysis Applications

- Material Modification

- Package Cleaning

- Passivation Etching

- Polyimide Etching

- Adhesion Promotion

- Biomedical Applications

- Polymerizaton

- Hybrid Cleaning

- Pre-Bond Cleaning


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