Tergeo plasma cleaner

Automatic tabletop plasma cleaner for research laboratories and low volume production

Typical applications:

• Wire bonding, flip chip underfill, device encapsulation and decapsulation

• SEM/TEM sample cleaning for carbonaceous contamination removal and oxide reduction

• Surface treat before biomedical coating and improve hydrophilicity of medical implants

• Optics, glass and substrate cleaning before epoxy bonding

• Photoresist ashing, descum and silicon wafer cleaning

• PDMS, microfluidics, glass slides and lab-on-a-chip

• Improve bonding for metal to metal or composite

• Improve bonding for plastic, polymer and composite materials

Features:

• Cleaning modes: Immersion plasma cleaning for high speed etching and surface modification; remote plasma cleaning for gentle surface contamination removal, such as SEM/TEM sample cleaning; pulsed operation to generate plasma with average rf power less than 0.5watt for extremely delicate samples.

• Operation methods: Automatic recipe execution; automatic job sequence execution; manual operation.

• Plasma sensor: dual plasma strength sensor (patent pending) monitors in-situ plasma source and remote plasma source. Plasma strengths are displayed on the LCD touchscreen in real-time.

• Advanced process control capabilities: pressure sensor, temperature sensor, gas flow rate meters in MFC, dual plasma strength sensors, automatic impedance matching

• Chamber materials: Aluminum flange and thick-wall high purity quartz tube offer enhanced chemical resistance and reduction of alkali impurities (Ca, K, Na) found in pyrex glass.

• Quartz chamber size: inner diameter:110mm; outer diameter: 120mm; depth 280mm

• Sample holder: 2mm thick high purity quartz plate

• RF antenna: External rf electrodes and antenna design reduces metal sputtering issue found in plasma cleaners with internal metal electrodes.

• RF power: 13.56MHz high frequency rf power supply with automatic impedance matching for in-situ plasma source. RF power has two options: 0-75watt and 0-150watt. 13.56MHz rf power generates plasma with much higher density than KHz power supply.

• Gas input: Up to three mass flow controlled gas input (0~100sccm). One additional port for venting and purging. ¼ inch Swagelok compression fitting connectors.

• User interface: 7-inch resistive touchscreen, touch with fingers, no stylus required.

• Recipe and job support: Total 20 customizable recipes. Up to three cleaning steps in job sequence.