Vacuum reflow soldering(Reflow soldering oven)
Applications Heating in vacuum and inert gas, Power semiconductors on heat sinks, Flip chip reflow, Melting of bumps, High intensity LED attach, Sealing of hermetic packages, Photovoltaic cell assembly, Die attach, Sintering of printed copper films, Assembly of hybrid circuits, Encapsulation of flat packs, MEMS and opto devices, Automotive sensors and high energy batteries, etc.
Specifications: Process environment: nitrogen, inert gas, formic acid Heating plate: size 260 x 210 mm Clearance vertical: 80mm between bottom and top heating, 60mm above the heating plate Chamber lid: manual operation with lid lock Viewing port: Ø80mm Maximum temperature: 650°C, Control deviation: +/- 0.5°C Heating elements: 8x/16x infrared heating lamps in one/two rows Ramp heat up max.: 250°C/minute Ramp cool down max.: 250°C/minute Temperature measurement and control: up to 4x K-Type thermocouples freely positional Heating control: Individual power control with adjustable power gain on every heating lamp Integrated overheat protection: electrical thermostat Vacuum measurement: integrated vacuum gauge down to 5mbar Process gas lines with digital flow meters: L1: 50slm, L2: 50slm, L3 via bubbler: 10slm, Cooling: 200slm Formic acid bubbler: 40 ml container on the front panel with manual refill port Chamber cooling: water cooling. External chiller or facility cooling is required Vacuum pump: optional
Interfaces: PC Software for process logging, file transfer; External user interface for remote control 
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