HIGH POWER EXPANDED PLASMA CLEANER

PDC-001-HP (115V) | PDC-002-HP (230V)

With twice the cleaning rate as the Expanded Plasma Cleaner, the High Power Expanded Plasma Cleaner is a versatile instrument, suitable for etching organic thin films(10-100 nm) as well as surface cleaning and modification.

FEATURES

Larger, benchtop unit

Adjustable RF power settings (Low, Medium, High)

Maximum RF powerof 45W

Low RF power setting is equivalent to High RF power setting on PDC-001/PDC-002

Includes a 6″ diameter x 6.5″ length Pyrex chamber

Hinged door with viewing window

Active fan cooling

Integral switch for a vacuum pump

1/8″ NPT metering valve to qualitatively control gas flow and vacuum pressure

1/8″ NPT 3-way valve to quickly switch from bleeding in gas, isolating the chamber, and venting

Weight: 37 lbs

Size: 11″ H x 18″ W x 9″ D

Optional PlasmaFlo gas mixer allows quantitative control of up to two (2) process gases and monitoring of chamber pressure

Optional quartz chamber and sample tray

Compatible vacuum pump available

REQUIREMENTS

Our Plasma Cleaners require a vacuum pump with a minimum pump speed of 1.4 m3/hr (23L/min) and ultimate total pressure of 200 mTorr (0.27 mbar) or less.